IEC 62878-2-5 Ed. 1.0 en:2019

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Device embedding assembly technology – Part 2-5: Guidelines – Implementation of a 3D data format for device embedded substrate
standard by International Electrotechnical Commission, 09/16/2019

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Category: IEC

Description

IEC 62878-2-5 defines the data format for active and passive devices embedded inside an organic board whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This PAS describes the expression of 3D data information, the concept of layers, the structure of board data, and definitions of information repeatedly used in design.