IEC 62418 Ed. 1.0 b

Description

IEC 62418 Ed. 1.0 b – Semiconductor devices – Metallization stress void test

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

Product Details

Edition:

1.0

Published:

04/22/2010

Number of Pages:

34

File Size:

1 file , 990 KB

Note:

This product is unavailable in Ukraine, Russia, Belarus