Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing

Published by	Publication Date	Number of Pages
IEC	08/15/2006	15

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Category: IEC

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IEC 62047-3 Ed. 1.0 b – Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing

Specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices. It is based on such a concept that a tensile testing system can be guaranteed in propriety and accuracy, when the measured tensile strengths of the standard test pieces, whose tensile strength is pre-determined, are within the designated range. It also specifies the test pieces to minimize characteristics deviation among the pieces.