Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-3: General test methods for materials and assemblies – Soldering paste for printed board assemblies

Published by	Publication Date	Number of Pages
IEC	01/08/2015	79

Category: IEC

Description

IEC 61189-5-3 Ed. 1.0 b – Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-3: General test methods for materials and assemblies – Soldering paste for printed board assemblies

IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.