User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

Published by	Publication Date	Number of Pages
IPC	12/01/2010	24

Category: IPC

Description

IPC 9631 – User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and calibration of that equipment.