Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emotting Diodes (LEDs)

Published by	Publication Date	Number of Pages
JEDEC	04/18/2012	12

Category: JEDEC

Description

JEDEC JESD51-50 – Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emotting Diodes (LEDs)

This document provides an overview of the methodology necessary for making meaningful thermal measurements on high-power light-emitting diodes (LEDs) built on single or multiple chips with one or more pn-junctions per chip. The actual methodology components are contained in separate detailed documents.