BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS

Published by	Publication Date	Number of Pages
JEDEC	08/01/2018	26

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Category: JEDEC

Description

JEDEC JESD22-B113B – BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS

The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of surface mount electronic components in an accelerated test environment for handheld electronic products applications. The purpose is to standardize the test methodology to provide a reproducible performance assessment of surface mounted components while duplicating the failure modes normally observed during product level test. This is not a component qualification test and is not meant to replace any product level test that may be needed to qualify a specific product and assembly.