This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.
All current amendments available at time of purchase are included with the purchase of this document.
Product Details
Published:
01/11/2022
ISBN(s):
9780539171525
Number of Pages:
24
File Size:
1 file , 2.4 MB
Product Code(s):
30434821, 30434821, 30434821
Note:
This product is unavailable in Ukraine, Russia, Belarus
