IEC 60191-6-1 Ed. 1.0 en

Description

IEC 60191-6-1 Ed. 1.0 en – Mechanical standardization of semiconductor devices – Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for gull-wing lead terminals

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

Product Details

Edition:

1.0

Published:

10/30/2001

Number of Pages:

7

File Size:

1 file , 230 KB

Note:

This product is unavailable in Ukraine, Russia, Belarus