IEC 60749-25 Ed. 1.0 b

Description

IEC 60749-25 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 25: Temperature cycling

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Product Details

Edition:

1.0

Published:

07/11/2003

Number of Pages:

25

File Size:

1 file , 650 KB

Note:

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