IEC 62769-4 Ed. 2.0 b

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Field Device Integration (FDI) – Part 4: FDI Packages

Published by Publication Date Number of Pages
IEC 02/05/2021 165
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IEC 62769-4 Ed. 2.0 b – Field Device Integration (FDI) – Part 4: FDI Packages

IEC 62769-4:2021 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.

Product Details

Edition:
2.0
Published:
02/05/2021
Number of Pages:
165
File Size:
1 file , 4.3 MB
Note:
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