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Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices standard by Association Connecting Electronics Industries, 04/01/1999
The purpose of this standard is to identify the classification level of non-hermetic solid state surface mount devices that are sensitive to moisture-induced stress. They can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation. This standard is used to determine what classification level should be used for initial reliability qualification.
Product Details
Published:
04/01/1999
Number of Pages:
20
Part of:
IPC M109
Note:
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