IPC J-STD-020D-1

Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC.

Product Details

Published:

03/01/2008

Number of Pages:

24

File Size:

1 file , 190 KB

Note:

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