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JEDEC JEP167
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Characterization of Interfacial Adhesion in Semiconductor Packages
standard by JEDEC Solid State Technology Association, 04/01/2013
This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.
Product Details
- Published:
- 04/01/2013
- Number of Pages:
- 30
- File Size:
- 1 file , 280 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus