JEDEC JEP167

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Characterization of Interfacial Adhesion in Semiconductor Packages
standard by JEDEC Solid State Technology Association, 04/01/2013

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This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.

Product Details

Published:
04/01/2013
Number of Pages:
30
File Size:
1 file , 280 KB
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