JEDEC JEP167A – Characterization of Interfacial Adhesion in Semiconductor Packages
This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.
Product Details
Published:
11/01/2020
Number of Pages:
32
File Size:
1 file , 390 KB
Redline File Size:
2 files , 3.8 MB
Note:
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