A revised method for determining the effects of bias conditions and temperature, over time, on solid state devices is now available. Revision B of A108 includes low temperature operating life (LTOL) and high temperature gate bias (HTGB) stress conditions, revised cool down requirements for high temperature stress, and a procedure to follow if parts are not tested within the allowed time window.
Product Details
Published:
06/01/2005
Number of Pages:
13
File Size:
1 file , 79 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
