JEDEC JESD217

JEDEC JESD217

$48.00

TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
standard by JEDEC Solid State Technology Association, 09/01/2010

PDF FormatPDF FormatMulti-User-AccessMulti-User AccessPrintablePrintableOnline downloadOnline Download
Category:

Description

This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.

Product Details

Published:
09/01/2010
Number of Pages:
44
File Size:
1 file , 1.8 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus

In Demand Now