IPC 2225

Description

IPC 2225 – Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)

This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.

Product Details

Published:

05/01/1998

ANSI:

ANSI Approved

Number of Pages:

44

File Size:

1 file , 590 KB

Product Code(s):

2225(D)1

Note:

This product is unavailable in Russia, Ukraine, Belarus