IPC 7094A – Design and Assembly Process Implementation for Flip Chip and Die-Size Components
IPC 7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach(DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristicsand dictates the appropriate assembly methodology. This standard focuses on design, assembly methodology, criticalinspection, repair and reliability issues associated with flip chip and die-size package technologies, including wafer-levelball grid array (WLBGA).
Product Details
Published:
01/01/2018
ISBN(s):
9781611933277
Number of Pages:
96
File Size:
1 file , 5.6 MB
Product Code(s):
7094-STD-0-P-0-EN-A, 7094-STD-0-P-0-EN-A
Note:
This product is unavailable in Russia, Ukraine, Belarus
