IPC J-STD-027

Description

IPC J-STD-027 – Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

Product Details

Published:

02/01/2003

Number of Pages:

20

File Size:

1 file , 90 KB

Product Code(s):

J-027(D)1, J-027(D)1

Note:

This product is unavailable in Russia, Ukraine, Belarus