IPC J-STD-027 – Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
Product Details
Published:
02/01/2003
Number of Pages:
20
File Size:
1 file , 90 KB
Product Code(s):
J-027(D)1, J-027(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus
